US Semiconductor/Package Design

So many semiconductor designs are done without consideration of packaging for production efficiency and savings. 1Talon takes into all the design considerations including thermal circuit analysis and most efficient design for the applications. This includes the latest wafer scale, chip scale, interposer and bumped die interface.

US Fabs Manufacturing

1Talon installs their designs and processes in multiple U.S. Foundries for those products the they wish to remain incountry for reasons such as Medical and Military designs. We can build to all of their specifications, test both electrical and visual 883 type requirements.

Malaysian Fabs Manufacturing

1Talon has business relationships with Malaysian foundry's for low and high volume applications. Our Foundries Mfg for commercial applications and include volume's supporting Apple products.